for advanced miniaturization
It’s critical for electronics makers to respond to rapid changes in the consumer marketplace—they need to speed their products to market in order to stay competitive in a fast-moving industry. The electronics assembly industry must keep pace with complex manufacturing challenges and the need for production optimization.
To this end, ITW’s Speedline Technologies has created high-precision equipment to help manufacturers produce ever-smaller circuitry and meet the demands of miniaturization. The Camalot® Smart Stream™ non-contact dispensing systems for surface mount electronics, chip packaging, and assembly applications accommodates the demand for smaller chips and a higher density of components on the circuit board—all without compromising quality or speed. Material is dispensed without use of a needle, yet retains accuracy and repeatable, fast flow rates. And fewer consumable parts are used.
The Momentum® Series Stencil Printer also uses cutting-edge technology for high volume circuit board manufacturing. The EdgeLoc board-clamping system employs new software controlled pressure, enhancing the Momentum’s printer’s ability to process complex boards quickly, accurately, and with ease.